Low-Temperature Bonding Using Silver Nanoparticles Stabilized by Short-Chain Alkylamines
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概要
- 論文の詳細を見る
In this paper, we report on low temperature bonding using silver nanoparticles stabilized by short-chain alkylamines with different numbers carbon between 8 to 12. The bonding can be achieved by simultaneous heating and pressurization. The shear strength increased as the decomposition temperature of the stabilizer decreased. In the case of silver nanoparticles stabilized with n-octylamine (having the lowest decomposition temperature among the three stabilizers), the shear strength was 24 MPa for bonding at 400 °C. The difference in the shear strength is probably related to the amount of residual organic material in the sintering layer; the residual organic material would hinder the sintering of the silver nanoparticles, which was suggested by thermogravimetric analysis (TGA) results.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2009-12-25
著者
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Yasuda Yusuke
Materials Research Laboratory Hitachi Ltd.
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Ide Eiichi
Materials Research Laboratory Hitachi Ltd.
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Morita Toshiaki
Materials Research Laboratory Hitachi Ltd.
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Yasuda Yusuke
Materials Research Laboratory, Hitachi, Ltd., 7-1-1 Omika-cho, Hitachi, Ibaraki 319-1292, Japan
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Morita Toshiaki
Materials Research Laboratory, Hitachi, Ltd., 7-1-1 Omika-cho, Hitachi, Ibaraki 319-1292, Japan
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