Study of bonding technology using silver nanoparticles

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概要

• 論文の詳細を見る
• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文

著者

• Yasuda Yusuke

  Materials Research Laboratory Hitachi Ltd.

関連論文

• Direct Bonding to Aluminum with Silver-Oxide Microparticles
• Low-temperature bonding using silver nanoparticles stabilized by short-chain alkylamines
• Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles
• Study of bonding technology using silver nanoparticles
• Study of Bonding Technology Using Silver Nanoparticles
• Low-Temperature Bonding Using Silver Nanoparticles Stabilized by Short-Chain Alkylamines

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