Direct Bonding to Aluminum with Silver-Oxide Microparticles
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2009-01-01
著者
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Yasuda Yusuke
Materials Research Laboratory Hitachi Ltd.
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HIROSE Akio
Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University
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MORITA Toshiaki
Materials Research Laboratory, Hitachi Ltd.
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IDE Eiichi
Materials Research Laboratory, Hitachi Ltd.
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Ide Eiichi
Materials Research Laboratory Hitachi Ltd.
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Hirose Akio
Division Of Materials And Manufacturing Science Graduate School Of Engineering Osaka University
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Hirose Akio
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Morita Toshiaki
Materials Research Laboratory Hitachi Ltd.
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Hirose Akio
Div. Of Materials And Manufacturing Sci. Osaka Univ.
関連論文
- Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses
- Direct Bonding to Aluminum with Silver-Oxide Microparticles
- Low-temperature bonding using silver nanoparticles stabilized by short-chain alkylamines
- Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles
- Study of bonding technology using silver nanoparticles
- Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior
- Effects of Microalloying Tin and Combined Addition of Silver and Tin on the Formation of Precipitate Free Zones and Mechanical Properties in Al-Zn-Mg Alloys
- Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders
- Nanoindentation Measurement of Interfacial Reaction Layers in 6000 Series Aluminum Alloys and Steel Dissimilar Metal Joints with Alloying Elements
- Effects of Zn-Based Alloys Coating on Mechanical Properties and Interfacial Microstructures of Steel/Aluminum Alloy Dissimilar Metals Joints Using Resistance Spot Welding
- Microstructure and Mechanical Property of 5000 Series Aluminum Stud Joint with Zinc Insert Using Friction Welding
- Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging
- Formation of High-Density Dislocations and Hardening in Femtosecond-Laser-Shocked Silicon
- Effects of Alloying Copper and Silicon on the Bondability of Dissimilar Metal Joints of Aluminum Alloys to Steel
- Effects of Zinc Insert and Al Content in Mg Alloy on the Bondability in Dissimilar Joints of Steel and Magnesium Alloys
- Characteristics and Estimation of Interfacial Microstructure with Additional Elements in Dissimilar Metal Joints of Aluminum Alloys to Steel
- Study of Bonding Technology Using Silver Nanoparticles
- New Method for Estimating Impact Strength of Solder-Ball-Bonded Interfaces in Semiconductor Packages
- Low-Temperature Bonding Using Silver Nanoparticles Stabilized by Short-Chain Alkylamines
- Interfacial Bonding Behavior between Silver Nanoparticles and Gold Substrate Using Molecular Dynamics Simulation