Interfacial Bonding Behavior between Silver Nanoparticles and Gold Substrate Using Molecular Dynamics Simulation
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概要
- 論文の詳細を見る
- 2012-12-01
著者
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Hirose Akio
Division Of Materials And Manufacturing Science Graduate School Of Engineering Osaka University
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Ogura Tomo
Division Of Materials And Manufacturing Science Graduate School Of Engineering Osaka University
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TATSUMI Hiroaki
Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University
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TAKAHARA Wataru
Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University
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Nishimura Masumi
Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University
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- Effects of Microalloying Tin and Combined Addition of Silver and Tin on the Formation of Precipitate Free Zones and Mechanical Properties in Al-Zn-Mg Alloys
- Nanoindentation Measurement of Interfacial Reaction Layers in 6000 Series Aluminum Alloys and Steel Dissimilar Metal Joints with Alloying Elements
- Effects of Zn-Based Alloys Coating on Mechanical Properties and Interfacial Microstructures of Steel/Aluminum Alloy Dissimilar Metals Joints Using Resistance Spot Welding
- Microstructure and Mechanical Property of 5000 Series Aluminum Stud Joint with Zinc Insert Using Friction Welding
- Formation of High-Density Dislocations and Hardening in Femtosecond-Laser-Shocked Silicon
- Effects of Alloying Copper and Silicon on the Bondability of Dissimilar Metal Joints of Aluminum Alloys to Steel
- Effects of Zinc Insert and Al Content in Mg Alloy on the Bondability in Dissimilar Joints of Steel and Magnesium Alloys
- Characteristics and Estimation of Interfacial Microstructure with Additional Elements in Dissimilar Metal Joints of Aluminum Alloys to Steel
- Study of Bonding Technology Using Silver Nanoparticles
- Interfacial Bonding Behavior between Silver Nanoparticles and Gold Substrate Using Molecular Dynamics Simulation