New Method for Estimating Impact Strength of Solder-Ball-Bonded Interfaces in Semiconductor Packages
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概要
- 論文の詳細を見る
A method for estimating the impact strength of a solder ball junction in encapsulated semiconductor packages was developed. This method reveals the impact force in a solder ball unit and the time required for a solder ball to break. The bombardment absorbed energy required for the ball to break is evaluated as impact strength. This method can be used to quantitatively evaluate the impact strength of solder ball junctions, which is difficult to do using conventional shear and tensile strength estimation methods.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2008-08-25
著者
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Morita Toshiaki
Materials Research Laboratory Hitachi Ltd.
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Kajiwara Ryoichi
Materials Research Laboratory, Hitachi, Ltd., Hitachi, Ibaraki 319-1292, Japan
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Ueno Isao
Materials Research Laboratory, Hitachi, Ltd., Hitachi, Ibaraki 319-1292, Japan
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Okabe Satoru
Materials Research Laboratory, Hitachi, Ltd., Hitachi, Ibaraki 319-1292, Japan
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