Application of Anisotropic Conductive Film to Fabrication of Molybdenum Field Emitter Arrays Using Transfer Mold Technique

概要

論文の詳細を見る
In the fabrication of molybdenum field emitter arrays (Mo FEA) by the transfer mold technique, anisotropic conductive film (ACF) was applied to the bond between the inverted mold structure and the transferred glass substrate. Without any electrical treatment of electrostatic bonding, the inverted mold was successfully bonded to an indium tin oxide (ITO) glass substrate under optimized thermal and pressure conditions. No additional conductive layers were used in the bonding process, and the bonded ACF was not chemically affected in the wet-etch process of the silicon inverted mold structure. The fabricated Mo FEA was structurally and electrically investigated and an anode current of 10 nA per emitter was obtained at a gate bias of 94 V. The results demonstrate the possibility of selective conduction in the fabrication of transfer mold FEA using ACF bonding.
2008-08-25