Effect of adherend temperature on bond strengths of resin bonding systems to denture base resin and a semi-precious alloy
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概要
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This study investigated the effect of adherend temperature on shear bond strengths of auto-polymerizing resin to denture base resin and 4-META/MMA-TBBO resin to silver-palladium-copper-gold (Ag-Pd-Cu-Au) alloy. Bonding procedure was carried out when adherend temperature was 10, 23, 37, or 55°C, and shear bond strengths (SBSs) were measured before and after thermocycling. Before thermocycling, there were no significant differences in bond strength among the four adherend temperatures for each adhesive resin: 31.59±6.11-32.89±2.12 MPa for auto-polymerizing resin; 35.43±2.2-38.38±0.61 MPa for 4-META/MMA-TBBO resin. After thermocycling, optimal adherend temperature to achieve the highest bond strength was 37°C for auto-polymerizing resin to denture base resin (30.02±2.29 MPa) and 10ºC for 4-META/MMA-TBBO resin to Ag-Pd-Cu-Au alloy (37.14±2.17 MPa).
著者
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Suzuki Shiro
Department Of Gastroenterology And Hepatology Tokyo Medical University
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Minami Hiroyuki
Fixed Prosthetic Clinic Kagoshima University Medical And Dental Hospital
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MINESAKI Yoshito
Fixed Prosthetic Clinic, Kagoshima University Medical and Dental Hospital
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Murahara Sadaaki
Department Of Fixed Prosthetic Dentistry Kagoshima University Graduate School Of Medical And Dental
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TANAKA Takuo
Department of Fixed Prosthetic Dentistry, Advanced Therapeutic Course, Kagoshima University Graduate School of Medical and Dental Sciences
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SAKOGUCHI Kenji
Department of Fixed Prosthetic Dentistry, Advanced Therapeutic Course, Kagoshima University Graduate School of Medical and Dental Sciences
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SHIOMUKI Daisaku
Department of Fixed Prosthetic Dentistry, Kagoshima University Graduate School of Medical and Dental Sciences
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