Ag-Sn系の液相焼結現象を応用した多層基板接合技術の開発−第1報：拡散過程の解析−

概要

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In order to construct the multi layers IVH (Interstitial Via Hole) structure with only one time hot pressing, we have developed the new diffusion bonding technology. In this paper, the sintering process of Ag-Sn mixed powders (Ag/Sn:65/35 mass%) between copper foils in IVH with hot vacuum pressing was investigated, and the effect of temperature on the respective diffusion reactions was discussed. Ag and Sn formed Ag3Sn up to 473 K with the solid diffusion reaction. At 483 K, Ag particles disappeared completely and the mixed compact consisted of Ag3Sn and excess Sn. Cu-Sn diffusion reaction between excess Sn and copper foil commenced at 493 K. Excess Sn was consumed completely below 573 K. The liquid phase of Sn contributed not only to Cu-Sn diffusion bonding but also to Ag3Sn sintering. As a result of hot pressing above 573 K, the mechanical properties were improved without large grain growth of Ag3Sn (about 4 μm).