A28 パルスレーザによるガラスのレーザスクライブにおける熱応力解析(OS9 レーザ応用加工(2))

概要

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In the cut process of glass, laser scribing is applied in which a crack grows stably in being quenched down immediately following CO_2 laser beam irradiation. Because the scanning velocity can be higher as the laser power is heightened, the laser power should be more than tens of watts in practical application. Therefore pulsed CO_2 laser is generally applied. In this research, we aimed to investigate the influence of the laser frequency in the laser scribing of glass. We conducted two dimensional thermal stress analyses in which the laser frequency and the pulse waveform are configurable, and considered the crack growth phenomenon by comparing the results with those of laser scribing experiment. The obtained conclusions are as follows: At a depth of more than 40 μm from the heated plane, the laser frequency does not influence the stress or the stress intensity factor. As a result, the crack depth is not influenced by the laser frequency because a crack grows to where the oscillation of the stress field is small enough. Therefore the crack growth phenomenon can be simply considered by analyses in which the laser oscillation is set to be continuous wave at the same power.
2010-11-19