319 結像光学系の回折を考慮したプリント基板レーザ穴あけの樹脂除去解析(OS13 レーザ応用加工)

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This paper describes two-dimensional axisymmetric analysis of non-steady heat conduction of two-layers composed of resin and metal in laser drilling of printed circuit board. In the present analysis, resinous evaporation and diffraction of optical system for image formation were considered, and influence of diffraction on hole shape was investigated. Latent heat of evaporation and absorptivity were estimated using hole depth in experimental results. Laser intensity distribution at resin surface was estimated using the calculated result of diffraction in the experiment. Experimental hole shapes were in good agreement with analytical results considering diffraction. It was concluded that twodimensional .axisymmetric analysis considering diffraction of optical system for image formation is necessary to estimate hole shape in laser drilling of printed circuit boards.
社団法人日本機械学会の論文
2004-11-19