E22 Study on Cleaving Mechanism of Silicon Wafer by Laser Beam Irradiation(Laser processing)

スポンサーリンク

概要

• 論文の詳細を見る

• Laser cleaving is used as a technique to separate a thin plate of brittle materials. In this paper, the influence of crystal orientation on crack propagation is investigated experimentally. As a workpiece, a (100) face silicon wafer is used. The pre-crack induced by a Vickers indenter is observed with an optical microscope. Additionally, laser cleaving along the semicircle is performed. The results show the crack propagation with laser cleaving is along the cleavage plane. When the crack propagates along a direction of cleavage plane, the roughness of the fracture surface is very small. When the crack propagates along the direction between two cleavage planes, the fracture surface has the periodic wave.

• 一般社団法人日本機械学会の論文
• 2009-12-01

著者

• Tanaka Ryutaro

  Graduate School Of Natural Science And Technology Kanazawa University

• UEDA Takashi

  Institute of Science and Engineering, Kanazawa University

• FURUMOTO Tatsuaki

  Institute of Science and Engineering, Kanazawa University

• HOSOKAWA Akira

  Institute of Science and Engineering, Kanazawa University

• TANAKA Ryutaro

  Institute of Science and Engineering, Kanazawa University

• Hosokawa Akira

  Graduate School Of Natural Science And Technology Kanazawa University

• Hosokawa Akira

  Institute Of Science And Engineering Kanazawa University

• TAKEDA Reiko

  Graduate School of Natural Science and Technology, Kanazawa University

• Takeda Reiko

  Graduate School Of Natural Science And Technology Kanazawa University

• Ueda T

  Nuclear Engineering Research Laboratory University Of Tokyo

• Tanaka Ryutaro

  Institute Of Science And Engineering Kanazawa University

• Furumoto Tatsuaki

  Institute Of Science And Engineering Kanazawa University

• Ueda Takashi

  Institute Of Science And Engineering Kanazawa University

• Ueda Takashi

  Institute Of Molecular And Cellular Biosciences University Of Tokyo

関連論文

• E23 Laser Sintering Characteristics of Metallic Powder with Yb Fiber Laser : Optimization of Processing Conditions about Laser irradiation(Laser processing)
• C13 Finishing of Inner Wall of Cooling Channel in Mold by High Speed Flowing(Abrasive finishing technology)
• Fabrication of a quartz optical fiber tip for dental treatment with Nd:YAG laser-Proposal of a new process with TiO2 powder
• Hardmilling with CBN and Coated Tools(Advanced machining technology (continued))
• Evaluation of grinding wheel surface by means of grinding sound discrimination
• Emittance and Energy Measurements of Low-Energy Electron Beam Using Optical Transition Radiation Techniques
• E22 Study on Cleaving Mechanism of Silicon Wafer by Laser Beam Irradiation(Laser processing)
• Hydrogen as the Cause of Step Bunching Formed on Vicinal GaAs(001)
• High-Charge S-Band Photocathode RF-Gun and Linac System for Radiation Research
• Super-High-Density Optical Disk Using Deep Groove Method
• Experimental Verification of Velocity Bunching via Shot-by-Shot Measurement at S-Band Photoinjector and Linac
• Measurement and Numerical Analysis of Ultrashort Electron Bunch Using Fluctuation in Incoherent Cherenkov Radiation
• Experimental Results of Laser Wakefield Acceleration Using a Femtosecond Terawatt Laser Pulse
• Method to Obtain Low-Dislocation-Density Regions by Patterning with SiO_2 on GaAs/Si Followed by Annealing
• Reduction of Stress in GaAs with In-Doped GaAs Intermediate Layer Grown on Si Substrate by Metalorganic Chemical Vapor Deposition
• The Influence of Growth Temperature and Thermal Annealing on the Stress in GaAs Layers Grown on Si Substrates : Condensed Matter
• The Biological Roles of Small GTPases and interacting Proteins in Plants
• Annealing Effect on Sputtered CoCr Films
• RNA-Binding Protein Hoip Accelerates PolyQ-Induced Neurodegeneration in Drosophila
• Pre-Groove Development for Laser Cleaving of Brittle Materials by Using Micro-Lens
• Development of Tool Edge Temperature Measurement Method in Wet Cutting
• Wear Characteristics of Ceramic Tools When Turning BN Free-Machining Steel
• Analysis of Cutting Behavior during Tapping and Measurement of Tool Edge Temperature Measured by a Two-Color Pyrometer

もっと見る 閉じる

スポンサーリンク