B30 超音波振動を利用した基板の非接触搬送技術の開発 : 非接触ガイドユニットの特性(OS-2 最新機械要素技術(1))

概要

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Glass substrate for various display device and semiconductor wafer gets larger, it becomes more fragile. Conventional transportation system damages the substrate by contact stress. In order to solve these problems, a new non-contact transportation technology is proposed. The substrate is levitated by aerostatic force and transported by the acoustic viscous force excited by traveling flexure deformation of stator. In this paper, non-contact guide unit to avoid derailment of the substrate is constructed. The guide units and stator are arranged alternately along the transportation road. The stable condjtion was obtained as the edge of the substrate coincided with the nodal line of oscillating plate of guide unit. The non-contact holding force was 20mN by using one guide unit.
2008-11-21