1216 EBSD・AFM法による超細粒ECAP銅のナノスケール強度評価(J10-1 マイクロ・ナノ材料システムの力学と強度・機能評価(1) 強度・機能評価法開発,ジョイントセッション,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

概要

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Ultrafine-grained Cu processed by ECAP (Equal Channel Angular Pressing) with the grain size of d = 300 nm was fatigued at low stress intensity factor to investigate the grain coarsening mechanism during fatigue. EBSD (Electron Backscatter Diffraction) and AFM (Atomic Force Microscopy) methods were employed for the nanometer-scale analysis. The results show that fatigue damage area around the crack is observed in coarsened grains. Slip damages with the primary and secondary slip system were activated during fatigue. The detailed observation before and after fatigue at the same region revealed that the grain boundary of the coarsened grain moves as a high angle boundary. The initial residual strain in ECAP-processed Cu is considered to be one of the driving factors of the high angle boundary.
社団法人日本機械学会の論文
2008-08-02