508 Walking Driveに基づく高耐荷重型超精密アライメント装置の開発(OS-4 機械要素技術)

概要

論文の詳細を見る
This paper presents a new ultraprecision alignment device with high load capacity, which is targeted for ultraprecision bonding in a vacuum. The ultraprecision bonding is recently needed for emerging production technologies such as nanoimprint, MEMS and WOW. The device is driven by 'Walking Drive', which is an unique driving method to realize ultraprecision positioning with long stroke by utilizing piezoelectric actuators. The method is suitable for high load capacity and the ultraprecision positioning in a vacuum. Mechanical parts of the device are designed by utilizing FEM analysis, so that the device has a high load capacity of greater than 1 ton. It is confirmed experimentally that the developed alignment system has the high load capacity and also fine positioning resolution of less than 10nm.
社団法人日本機械学会の論文
2006-11-24