125 混合潤滑状態におけるCMPプロセスの解析 : 摩擦抵抗に着目した解析モデルの実験的検証(OS-15 研磨技術)

概要

論文の詳細を見る
An analytical approach to estimate the coefficient of friction (COF) in chemical mechanical polishing (CMP) process in mixed lubrication is developed in the present research. The Stribeck curve is calculated by experimental and analytical results of friction resistances. An analytical model, which can predict the distribution of contact stress and fluid pressure under the condition of nonuniform velocity distribution by utilizing the Stribeck curve, is developed. Polishing experiments are carried out for the verification of the model in terms of the friction resistance. It is confirmed that the effect of the wafer rotational speed on the friction resistance can be predicted successfully by the developed analytical model.
社団法人日本機械学会の論文
2006-11-24