Solid State Reaction Bonding of Non-Oxide Ceamics to Metals (Report I) : Bonding of Si_3N_4 to Al Alloys(Materials, Metallurgy & Weldability)
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概要
- 論文の詳細を見る
The solid state reaction bonding of Si_3N_4 to Al alloys (A1050 and AC-8A) is studied. The bonding was done in vacuum (7×10^<-3>Pa) changing bonding temperature (627-877K), bonding time (0-180min) and bonding pressure (0-350MPa) respectively. The strength of bonded joint between Si_3N_4 and Al alloy increases with the increase of bonding temperature, bonding time and bonding pressure respectively. The reaction between Si_3N_4 and aluminum is studied by using QMS (Quadrupole Mass Spectrometer) and XRD (X-ray Diffraction). Si_3N_4 reacted with aluminum at 1273K to give AlN and Si. The solid state reaction bonding of Si_3N_4 to Al alloy may be due to the formation of AlN and Si at the interface.
- 大阪大学の論文
著者
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ARATA Yoshiaki
Osaka University
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OHMORI Akira
Osaka University
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Sano Saburo
Ceramics Research Inst., National Inst. of Advanced Industrial Science and Tech.
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Sano Saburo
Osaka University
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Ohmori A
Osaka Univ. Osaka Jpn
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