Simulation of the Copper Diffusion Profile in SiO_2 during Bias Temperature Stress (BTS) Test
スポンサーリンク
概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 2002-02-01
著者
-
KIM Ki-Bum
School of Life Sciences and Biotechnology, Korea University
-
Kim Ki-bum
School Of Life Sciences And Biotechnology Korea University
-
Kwon Jang-yeon
School Of Materials Science And Engineering Seoul National University
-
Kim K‐s
Konkuk Univ. Kor
-
KIM Ki-Su
School of Materials Science and Engineering, Seoul National University
-
JOO Young-Chang
School of Materials Science and Engineering, Seoul National University
-
Joo Young-chang
School Of Materials Science And Engineering Seoul National University
-
Joo Young-chang
School Of Materials Science & Engineering Seoul National University
-
Kim Ki-su
School Of Materials Science And Engineering Seoul National University
関連論文
- Two-Dimensional Electrophoretic Analysis of Radio Frequency Radiation-Exposed MCF7 Breast Cancer Cells
- Reduction of the threshold voltage fluctuation in an electrical phase change memory device with a Ge_1Sb_2Te_4 / TiN cell structure
- Simulation of the Copper Diffusion Profile in SiO_2 during Bias Temperature Stress (BTS) Test
- Sensitivity Characteristics of Positive and Negative Resists at 200kV Electron-Beam Lithography
- Electromigration Behavior of Eutectic SnPb Solder
- Effects of Annealing Temperature on Electrical Characteristics of Solution-Processed Zinc Tin Oxide Thin-Film Transistors
- Grain Growth Simulation of Damascene Interconnects: Effect of Overburden Thickness
- Sensitivity Characteristics of Positive and Negative Resists at 200 kV Electron-Beam Lithography