Electromigration Behavior of Eutectic SnPb Solder
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 2002-12-15
著者
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Joo Y‐c
Seoul National Univ. Seoul Kor
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Choi Jae-young
School Of Materials Science & Engineering Seoul National University
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Joo Young-chang
School Of Materials Science & Engineering Seoul National University
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LEE Sang-Su
School of Materials Science & Engineering, Seoul National University
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Lee Sang-su
School Of Materials Science & Engineering Seoul National University
関連論文
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- Simulation of the Copper Diffusion Profile in SiO_2 during Bias Temperature Stress (BTS) Test
- Electromigration Behavior of Eutectic SnPb Solder
- Grain Growth Simulation of Damascene Interconnects: Effect of Overburden Thickness