Grain Growth Simulation of Damascene Interconnects: Effect of Overburden Thickness

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概要

• 論文の詳細を見る

• We simulated grain growth in a damascene trench structure varying the overburden thickness, driven by the surface and the interface energy minimization. The modified Potts model based on the Monte Carlo method was implemented. To determine whether the trench evolved a bamboo microstructure or not, we analyzed the normalized number of the triple junction points per cross-section that approaches zero with completion of a bamboo. The results of both the simulation and the triple junction analysis suggest that only the trench whose depth is significantly thicker than the overburden thickness can evolve a bamboo. While the trench and the overburden evolve their microstructure independently at the initial stages, only the microstructure of the thick overburden continues to grow to the inside of the trench because of their large enough grain size. These may provide a clue to understand the dependence of the trench microstructure on the overburden counterpart.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2004-06-15

著者

• Park Young-joon

  Future Technology Research Division Korea Institute Of Science And Technology

• Hwang Nong-moon

  School Of Materials Science And Engineering Seoul National University

• Joo Young-chang

  School Of Materials Science & Engineering Seoul National University

• Joo Young-Chang

  School of Materials Science and Engineering, Seoul National University, Seoul 151-744, Korea

• Hwang Nong-Moon

  School of Materials Science and Engineering, Seoul National University, Seoul 151-744, Korea

• Jung Jung-Kyu

  School of Materials Science and Engineering, Seoul National University, Seoul 151-744, Korea

• Park Young-Joon

  Future Technology Research Division, Korea Institute of Science and Technology, Seoul 136-791, Korea

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• Grain Growth Simulation of Damascene Interconnects: Effect of Overburden Thickness

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