Development of Mechanical Systems for Micro-Bonding by Adhesive : Proposal of Micro-Application Technology of Adhesive Resin
スポンサーリンク
概要
- 論文の詳細を見る
This paper proposes a method of application of micro amounts of adhesive resin by using a needle. The process of micro-application of the resin is experimentally investigated. The amount of adhesive resin on the needle is influenced by the shape and size of the needle. The micro-application of adhesive resin is dependent on the handling process of the needle to transfer adhesive resin on the adherent surface. The design parameters of mechanical systems for micro-application of adhesive resin is discussed.
- 一般社団法人日本機械学会の論文
- 1996-06-15
著者
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HORIE Mikio
Precision and Intelligence Laboratory, Tokyo Institute of Technology
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Horie Mikio
Precision And Intelligence Laboratory Tokyo Institute Of Technology
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Horie Mikio
Precision & Intelligence Laboratory Tokyo Institute Of Technology
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Ikegami Kozo
Precision And Intelligence Laboratory Tokyo Institute Of Technology
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KOBAYASHI Futoshi
Graduate Student, Tokyo Institute of Technology
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OKABE Shinji
Precision and Intelligence Laboratory, Tokyo Institute of Technology
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OKABE Shinji
Graduate Student, Tokyo Institute of Technology
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Okabe Shinji
Precision And Intelligence Laboratory Tokyo Institute Of Technology
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Kobayashi Futoshi
Graduate Student Tokyo Institute Of Technology
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