Adhesion Failure of PVD Films Caused by Repeated Bending of Substrates
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概要
- 論文の詳細を見る
A method to evaluate the adhesion of PVD films was devised. Bi, Al and Si0 films of various thicknesses were thermally evaporated onto copper or mild steel substrates. The substrate was subjected to repeated plastic bending. The adhesion failure life (bending cycles until the film-peeling) was taken as a measure of the adhesion. It was found that this method gave a result analogous to that obtained from the conventional method using adhesives. It was further confirmed that this method was applicable when the adhesion was so strong that the conventional method failed.
- 社団法人応用物理学会の論文
- 1981-09-05
著者
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Fujiyama Hirokazu
Department Of Intelligent Mechanical Engineering Fukuoka Institute Of Technology
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Fujiyama Hirokazu
Department Of Mechnical Engineering Fukuoka Institute Of Technology
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Nishimura Akinori
Department of Physics, Faculty of Science, Hiroshima University
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KUWAHARA Kaizo
Department of Electrical Engineering, Hiroshima-Denki, Institute of Technology
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Kuwahara Kaizo
Department Of Materials Engineering Faculty Of Engineering Hiroshima University
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Nishimura Akinori
Department Of Materials Engineering Faculty Of Engineering Hiroshima University
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