Resistivity Anisotropy in Oblique Incidence Evaporated Films

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概要

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• The resistance change along a ring, prepared by photoetching a thin flat film evaporated on a glass substrate, is analized and the resistivity anisotropy is separated from the effect of thickness gradient. It is found that in thin films of 84.5 % Ni-Fe the resistivity anisotropy coefficient β, defined as β=(ρ_<//>-ρ_⊥)/(ρ_<//>+ρ_⊥) (ρ_<//> : resistivity in the film plane parallel to the plane of incidence, ρ_⊥ : resistivity perpendicular to the plane of incidence), increases with the angle of incidence, makes a maximum at 70° and then decreases to a negative value. This behaviour is very similar to that of the magnetic uniaxial anisotropy constant except that it is already negative at 70°. In the case of thin films of Cu, there is no appreciable change in β at low angles of incidence, only a decrease being observed at high angles of incidence above 60°.

• 社団法人応用物理学会の論文
• 1974-07-05

著者

• HIROTA HIDENORI

  Department of Agrobiology, Niigata University

• KUWAHARA Kaizo

  Department of Electrical Engineering, Hiroshima-Denki, Institute of Technology

• Hirota Hidenori

  Department Of Precision Engineering Hiroshima University

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• Thickness Dependence of Domain Orientation in Thin Nickel Films
• Magnetoresistance Effect in the Magnetization Reversal of Permalloy Films

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