Applications of a Micro X-Ray Spectrometer and a Computer Simulator for Stress Analyses in Al Interconnections (SOLID STATE DEVICES AND MATERIALS 1)
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概要
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An energy-dispersive X-ray diffraction spectrometer with a 5.7 μmφ X-ray probe and a computer stress simulator are complementarily used with each other for strain analyses in aluminum interconnections for ULSIs. They clarify that the strains in Al layers remarkably increase in proportion to W^<-0.6> 〜 W^<-1>(W: linewidth) when their widths are narrowed to below approximately 3 μm. This phenomenon is caused by forces (thermal stresses) which act upon the side walls of Al layers.
- 社団法人応用物理学会の論文
- 1989-11-20
著者
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Yamamoto N
Sharp Corp. Nara Jpn
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Sakata Shinji
Mechanical Engineering Research Laboratory Hitachi Ltd.
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YAMAMOTO Naoki
Central Research Laboratory, Hitachi Ltd.
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Yamamoto Naoki
Central Research Laboratory Hitachi Ltd.
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