Mercury-Sensitized Hydrogen Radical Photoetching of Undoped Hydrogenated Amorphous Silicon and Crystalline Silicon
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概要
- 論文の詳細を見る
An etching study for undoped a-Si:H films and c-Si has been carried out by using Hg-sensitized H radicals in H_2 gas under UV-light irradiation with a low pressure mercury lamp. It has been found that the etch rate of undoped a-Si:H increases with decreasing substrate temperature and H_2 flow rate, as well as with increasing UV-light intensity. Concerning H_2 gas pressure dependence, a maximum etch rate was observed at around 0.1 Torr. An adsorbed layer, composed of H_2 molecules, H radicals, Hg atoms and photoexcited Hg atoms, can be considered to be formed on the surface. The adsorbed layer irradiated with UV light may supply a sufficient number of H radicals near the surface to rapidly cut off the Si network, leading to the formation of volatile SiH_x.
- 社団法人応用物理学会の論文
- 1989-10-20
著者
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ITO Hiroshi
Research Institute for Food Science, Kyoto University
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Sakuma Naoshi
Research And Development Center Toshiba Corporation
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NOZAKI Hidetoshi
Research & Development Center, Toshiba Corporation
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- Mercury-Sensitized Hydrogen Radical Photoetching of Undoped Hydrogenated Amorphous Silicon and Crystalline Silicon
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