Si Surface Cleaning by Si_2H_6-H_2 Gas Etching and Its Effects on Solid-Phase Epitaxy
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概要
- 論文の詳細を見る
Si surface cleaning with Si_2H_6-H_2 was studied for lateral solid-phase epitaxy (L-SPE) of CVD a-Si films. The cleaning was performed at 850℃, which is considerably lower than the previously-reported H_2-cleaning temperature (1100℃). This is because etching of native oxide is enhanced by a reaction between oxide and Si-atoms dissociated from Si_2H_6. The effects of Si_2H_6-cleaning on L-SPE were studied using a Si (100) wafer with SiO_2 stripes. After Si_2H_6-cleaning or H_2-cleaning at 850℃, CVD a-Si films are deposited on the wafers, then crystallized by annealing (575℃). An H_2-cleaned sample showed imperfect L-SPE because of a residual native-oxide layer at the a-Si / substrate interface. In the Si_2H_6-cleaned sample, the native-oxide layer was removed, and L-SPE growth was observed uniformly in the wafer. Si_2H_6-cleaning at 850℃ is applicable for substrates with abrupt impurity distribution.
- 社団法人応用物理学会の論文
- 1987-11-20
著者
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KUNII Yasuo
NTT LSI Laboratories
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SAKAKIBARA Yutaka
NTT LSI Laboratories
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Sakakibara Yutaka
Ntt Lsi Laboratories Nippon Telegraph And Telephone Corporation
関連論文
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- Evaluation of Hot-Hole Induced Interface Traps at the Tunneling SiO_2(3.5nm)-Si Interface by the Conductance Technique
- Measurememt of Ge/Si Ratio of SiGe-Layer on Si Substrate Using Total-Reflection X-Ray Fluorescence
- Si Surface Cleaning by Si_2H_6-H_2 Gas Etching and Its Effects on Solid-Phase Epitaxy