Microfabrication of X-Ray Absorber W Utilizing Al_2O_3 as an Etching Mask
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1992-12-30
著者
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Shinji Sugihara
Ulsi Research Center Toshiba Corporation
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ITOH Masamitsu
ULSI Research Center, Toshiba Corporation
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GOMEI Yoshio
ULSI Research Center, Toshiba Corporation
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Gomei Yoshio
Ulsi Research Center Toshiba Corporation
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Itoh Masamitsu
Ulsi Research Center Toshiba Corporation
関連論文
- Microfabrication of X-Ray Absorber W Utilizing Al_2O_3 as an Etching Mask
- Fabrication of an ultra Low Stress Tungsten Absorber for X-Ray Masks : Lithography Technology
- Effects of Mask Line-and-Space Ratio in Replicating near-0.1-μm Patterns in X-Ray Lithography
- Sub-0.15 μm Pattern Replication Using a Low-Contrast X-Ray Mask
- Analysis of Sub-0.15 μm Pattern Replication in Synchrotron Radiation Lithography
- The Effects of HCl Added to Chemical Vapor Deposition Source Gases for Producing a SiC X-Ray Mask Membrane
- Silicon Oxide Deposition into a Hole Using a Focused Ion Beam : Focused Ion Beam Process
- Silicon Oxide Deposition into a Hole Using a Focused Ion Beam
- Estimation of the Density and Roughness of Thin Monolayer Films by Soft X-Ray Reflectivity Measurements