Three-Dimensional Passive Elements for Compact GaAs MMICs (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
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概要
- 論文の詳細を見る
Novel three-dimensional structures for passive elements-inductors, capacitors, transmission lines, and airbridges-have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1 / 4 the size of conventional ones.
- 社団法人電子情報通信学会の論文
- 1993-06-25
著者
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Hirano Makoto
Ntt Lsi Laboratories
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Imai Y
Department Of Electrical And Electronic Engineering Ibaraki University
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NISHIKAWA Kenjiro
NTT Network Innovation Laboratories, NTT Corporation
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Asai Kazuyoshi
Ntt Lsi Laboratories
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Tokumitsu Masami
NTT LSI Laboratories
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NISHIKAWA Kenjiro
NTT Wireless Systems Laboratories
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Imai Yuhki
NTT Group Strategy Planning Department
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Toyoda Ichihiko
NTT RCS Laboratories
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Nishikawa Kenjiro
NTT RCS Laboratories
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Hirano M
Ntt Electronics Corporation
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Tokumitsu M
Ntt Electronics Corporation
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Toyoda Ichihiko
NTT Network Innovation Laboratories, NTT Corporation
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