Three-Dimensional MMIC and Its Application : An Ultra-Wideband Miniature Balun
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概要
- 論文の詳細を見る
A new three-dimensional MMIC structure and an ultra-wideband miniature MMIC balun are proposed. The MMIC is a combined structure of multilayer MMICs and U-shaped micro-wires. This technology effectively reduces chip size and enhances MMIC performance. The proposed balun is constructed with three narrow conductors located side by side. The U-shaped micro-wire technology is employed to reduce the insertion loss and chip size. 1.5±1 dB insertion loss over 10 to 30 GHz, and 2 dB and 5 degrees of amplitude and phase balances over 5 to 35 GHz have been obtained. The intrinsic area of the balun is only 450×800μm, about 1/5 to 1/3 the area of recently reported miniaturized MMIC baluns.
- 社団法人電子情報通信学会の論文
- 1995-08-25
著者
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Hirano Makoto
Ntt Electrical Communications Laboratories
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TOYODA Ichihiko
NTT Network Innovation Laboratories, Wireless Systems Innovation Laboratory
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TOYODA Ichihiko
NTT Electronics Corporation
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TOKUMITSU Tsuneo
NTT Wireless Systems Laboratories
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Hirano M
Ntt Electronics Corporation
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Tokumitsu T
Fujitsu Quantum Devices Ltd. Yamanashi‐ken Jpn
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Toyoda Ichihiko
NTT Network Innovation Laboratories, NTT Corporation
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