Fabrication Processes for High-T_c Superconducting Integrated Circuits Based on Edge-Type Josephson Junctions(Special Issue on Superconductive Electron Devices and Their Applications)
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概要
- 論文の詳細を見る
We have studied an in situ edge preparation process and the effect of a substrate rotation during the edge preparation in order to improve the uniformity and electrical characteristics of high-T_c edge-type Josephson junctions. The improved YBa_2Cu_3O_x/PrBa_2Cu_3O_x/YBa_2Cu_3O_x edge junctions showed small 1σ-critical current spreads as low as 10% for 12 junctions. We have confirmed that the spreads do not incrase significantly by adding groundplane over the junctions. In this paper, we will describe these processes developed for the fabrication of high-T_c superconducting integrated circuits.
- 社団法人電子情報通信学会の論文
- 1998-10-25
著者
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Hidaka M
Istec/srl Tsukuba‐shi Jpn
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Hidaka Mutsuo
Istec/srl
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Hidaka Mutsuo
Fundamental Research Laboratories Nec Corporation
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Satoh Tetsuro
Fundamental Research Laboratories Resources And Environment Protection Research Laboratories Nec Cor
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Satoh Tetsuro
Istec/srl
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Satoh Tetsuro
Fundamental Research Laboratories Nec Corporation
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Tahara S
System Devices Research Laboratories Nec Corporation
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TAHARA Shuichi
Fundamental Research Laboratories, NEC Corporation
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