Analysis of Bending Creep Behavior of Silicon Nitride Ceramics at Elevated Temperature
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概要
- 論文の詳細を見る
Three-point bending creep behavior of hot-pressed silicon nitride ceramics was investigated at 1170℃. A unique creep constitutive equation consisting of linear and power law terms was proposed, and the numerical calculation programs for determining the parameters included in the constitutive equation and for describing the creep deformation behavior of silicon nitride ceramics at elevated temperatures were developed. The model for interpreting the time-dependent deflection rate and the change in curvature of the beam due to creep under three-point bend loading was also developed, which fitted well the experimental data.
- 一般社団法人日本機械学会の論文
- 1995-04-15
著者
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YANG Hong
Department of Pathology, Xuanwu Hospital, Capital University of Medical Sciences
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Yang H
Kwangju Inst. Sci. And Technol. Kwangju Kor
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Yang Hong
Microelectronics Centre School Of Electrical And Electronics Engineering Nanyang Technological Unive
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Yang H
Department Of Materials Science And Engineering Kwangju Institute Of Science And Technology
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Yang Hong
Department Of Information Engineering Xidian University
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Hatanaka Kenji
Department Of Biomaterials Okayama University Graduate School Of Medicine Dentistry And Pharmaceutic
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Yang H
China Pharmaceutical Univ. Naning Chn
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Yang Hong
Department Of Chemistry North Carolina State University
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