携帯情報端末におけるマイクロインダクティブコンポーネント

概要

論文の詳細を見る
With the recent development of handy phone systems and terminals, the size of microwave circuits is becoming smaller and the integration level is becoming higher to achieve low cost and small size of the handy phone terminals. With the advent of MMICs (Micro-wave Monolithic Integrated Circuits), indyctive components have been fabricated on semiconductor substrates in planar form. Recently, as Si devices show high speed and high frequency operation, inductive components with smaller size are being fabricated on dielectric layers over Si substates. In addition, active inductors using active debices, inductive components fabricated on multi-layer ceramic substrates and 3-dimensional MMICs have been reported. In this paper, the curent development and status of the design and fabrication techniques of inductive components are introduced. As an application of inductive components to microwave circuits, the design, fabrication and performance of the L-band and C-band low-noise Si-MMIC amplifiers are presented.
社団法人日本磁気学会の論文
1999-07-01