E208 低風速におけるパッケージまわりの流れと熱伝達(オーガナイズドセッション21 : 電子機器の熱設計と解析の応用)

概要

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An experimental study was preformed to investigate the flow and heat transfer around a thin square block, simulating a package of electronic equipment. The height and the side length of the block were H=2mm and c=45mm, respectively. The mean velocity of air in a rectangular duct, Um, ranged from 0.24 to 4 m/s, and the duct height, H_D, ranged from 3.8 to 10 mm. The temperature distribution on the block was measured by an infrared camera. From the result of the present investigation, it was found that the heat transfer distribution on the top face of the block can be predicted by the theory of laminar flat plate using the factor of U_m/β^2, where β is the opening ratio defined by β=(H_D-H)H_D. The average Nusselt number on the top face is formulated using the modified Reynolds number defined by Re_c^*=(U_m/β^2)c/v.
社団法人日本機械学会の論文
2001-11-03