704 環境調和形ハロゲンフリー基板の高温疲労信頼性評価

概要

論文の詳細を見る
Effect of elevated temperature on fatigue reliability of halogen-free printed circuit board was evaluated. Especially fatigue mechanism at elevated temperature was demonstratively carried out. Main results were as follows. (1) Fatigue life of halogen-free material at elevated temperature were shorter than that at room temperature. (2) From fractography by using SEM(Scanning electron micrograph), resin adhesion to reinforced fiber at elevated temperature was less than that at room temperature. From this fact, it was suggested that fatigue crack propagation of halogen-free material at elevated temperature occurred in interface between reinforced fiber and resin, and that at room temperature occurred during resin. It was thought that difference of fatigue mechanism effected fatigue life.
一般社団法人日本機械学会の論文
2002-08-23