309 ケイ素含有DLC被膜の熱電特性評価(OS3-(3)オーガナイズドセッション《環境とエネルギー》)

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This paper presents an investigation of the influence of the silicon addition to thermoelectric performance of DLC films on glass substrates using RF plasma CVD method. The DLC films were prepared using methan (CH_4) and hexamethyldisiloxan (HMDSO) concentration from 0% to 100% as the source gas. The respective thermoelectric performance of the DLC films were evaluated and compared. The Seebeck coefficients of the DLC films decreased with increasing the HMDSO concentration at the range from 0% to 50%. However the Seebeck coefficients was identical with 50% the HMDSO concentration increased to 100%. Resistivity of the DLC films was creased with increasing HMDSO concentration at temperatures from 50℃ to 200°C. However, vicinity the room temperature, the specific electrical resistance of the each DLC films were identical. The power factor of the DLC films was decreased with increasing the HMDSO concentration at temperatures from room temperature to 200℃.
2010-08-27