330 UV-LIGA/Ni電鋳によるマイクロばね要素の創製とSEM内特性試験システム(マイクロ材料)

概要

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Materials and microstructures are subjected to 3D positioning table. Compressive load is generated by a lever mechanism driven by a piezoelectric actuator and the specimen's displacement is detected by an eddy current displacement sensor. The configuration of specimen or microstructure and the dimensional testing condition such as loading position is measured by the image analyses of 3D-SEM. Specimens and microstructures such as a small spring are loaded in compression and bending. The compression tests were carried out on microsprings of Ni fabricated by UV-LIGA process in a SEM microscopic field of view. The spring was S-shaped and was 1 mm in height, 0.85 mm in width and 50 micrometers in thickness. By using the apparatus, characteristic behavior of the spring was detected and evaluated.
一般社団法人日本機械学会の論文
2000-06-23