極細線の熱分解による被覆除去とその接続装置の開発

概要

論文の詳細を見る
The automated bonding technique for very fine insulated wires was required to keep pace with multipin semiconductors or high-density circuit boards. We obtained the relationship between the temperature and the time for thermal decomposition of the insulation of wires using Ozawa's method of analyzing thermogravimetric data, and found that it gives essentially the appropriate temperature. Applying this result, we developed bonding equipment for semiconductors.
一般社団法人日本機械学会の論文
1990-11-25