保持時間を有する引張変形下における純銅の応力腐食割れ

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Stress corrosion cracking (SCC) of pure copper has been under investigation for over 30 years. Various researchers have reported that Cu fails via a tarnish-rupture mechanism. Recently, the strain rate sensitivity of SCC on Cu alloys was studied using the slow strain-rate test (SSRT). This method may not be adequate to verify the validity of the tarnish-rupture mechanism because of the slow strain rates employed. In the present study, the crack initiation and growth mechanisms operating during SCC of pure Cu were studied. The specimens used were manufactured from 99.9wt. % vacuum-annealed Cu. The corrosive medium was 3.0 kmol. m^<-3> NaNO_2 solution at 293±3 K. A range of dipping times (t_P), holding times (t_H), and total strain (ε_T) were utilized. In this context, t_P is the time for which the specimen was dipped in the solution prior to the start of the strain application, t_H is the time for which the specimen is held while being subjected to a fixed amount of strain E and ε_T is the total strain applied to the specimen during step-strain testing (SST). The results can be summarized as follows. Three different modes could be identified through SST. These modes were classified as A, B and C in this study. In type A, no cracking occurred in the Cu even though a film formed on the Cu surface. In type B, the crack formed but did not propagate through the depth. In type C, the crack propagated through the specimen thickness and then grew along grain boundaries. It was also found that SST was capable of generating more severe conditions than SSRT. This is illustrated by comparing the stress-strain curves to failure for SSRT and SST.
一般社団法人日本機械学会の論文
1995-10-25

保持時間を有する引張変形下における純銅の応力腐食割れ

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