超伝導薄膜の界面端部近傍の応力場に関する熱弾性解析 : 異材界面を有する弾性体の基本解を用いた境界要素法の適用

概要

論文の詳細を見る
Devices of thin film in the high-Tc superconductor are subjected to thermoelastic loads because they are processed in high temperature and operated in cryogenic temperature. Serious problems exist in the reliability of the devices due to thermal stresses. In this study, the stress distribution and singularity near the edge of the interface between a thin film and its substrate are discussed by thermoelastic analysis. A boundary element method using fundamental solution of dissimilar materials is extended to the thermoelastic problem. The stress distribution near the edge of the interface can be calculated with high accuracy, because there is no boundary integral terms at the interface. The singular stress field near the edge of the interface is also obtained.
社団法人日本機械学会の論文
1998-07-25