半導体チップのワイヤボンディングプロセスにおける損傷評価解析

概要

論文の詳細を見る
Wire bonding, which is a process of connecting a semiconductor chip and a lead frame by a thin metal wire, is one of the important processes in electronic packaging. This paper presents the damage estimation of a G_aA_s chip during the gold (Au) wire bonding process. The Au wire bonding process is carried out by pressing an Au ball made at a tip of the Au wire on a semiconductor chip and vibrating it by ultrasonication. High contact pressure is useful for shortening the process cycle; however, it sometimes causes damage to the semiconductor chip. Elastic plastic large-deformation contact analysis is performed and the distributions of the stress in a G_aA_s chip is investigated. The possibility of fracture under the usual wire bonding pressure is expected in a G_aA_s chip.
一般社団法人日本機械学会の論文
1996-03-25