粉末粒子の静電加速による特殊加工法の研究(第5報) : タングステン微粒子の高速衝撃付着とその界面特性

概要

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The possibility of a film formation based on impact adhesion of solid particles was investigated by making tungsten submicron-sized particle beam vertically irradiate at the velocities of several hundreds m/s onto silicon substrate. The deposition phenomena of impact particle were examined by evaluating geometrical parameters of each deposit, and it became clear that relatively small particles are selectively deposited and accompanied by severe plastic self-flow and slight penetration into substrate, and the deformation degree depends on the impact velocity. As for the interfacial characteristics of film-deposited silicon, the tensile adhesive strength superior to the fracture strength of silicon and nearly ohmic current-voltage characteristics are observed which are similar to thermally joined junction, with both of pull testing and point-contact diode measurement. These suggest metallurgical change at interfacial layer of silicon.
公益社団法人精密工学会の論文
1991-06-05