アライナ用ステージシステムの開発(第1報) : 粗微動分離方式を適用した場合の基本特性

概要

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This paper discusses a new concept of wafer stage system for step and repeat type aligner. High rigidity of stage mechanism and high gain of stage control system are required to improve accuracy and acting time of stage positioning. But as wafer size becomes large and the mass of the stage system increases, it becomes difficult to design stage mechanism of high rigidity. In this study, a new type stage, in which a fine stage is separated from a coarse stage, is proposed to reduce the mass of movable part. An experimental apparatus is made to examine the effect of this philosophy. Positioning is carried out with a closed-loop control system using laser measurement system. The experimental results indicate that this stage system is capable of fine positioning with an error less than 6.4 nm and coarse positioning with an acting time 200 ms for a 15 mm step.
公益社団法人精密工学会の論文
1991-12-05