A Low Temperature Process of Bonding Fine Pitch Au/Sn Bumps in Air
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概要
- 論文の詳細を見る
- 2006-09-13
著者
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Wang Ying-hui
The Univ. Of Tokyo Dept. Of Precision Eng. School Of Eng.
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Suga Tadatomo
Dep. Of Precision Engineering School Of Engineering The Univ. Of Tokyo
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Suga Tadatomo
The Univ. Of Tokyo Dept. Of Precision Eng. School Of Eng.
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NISHIDA Kenji
Materials Analysis Station, National Institute for Materials Science
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HUTTER Matthias
Fraunhofer IZM
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KIMURA Takashi
Materials Analysis Station, National Institute for Materials Science
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Nishida Kenji
Materials Analysis Station National Institute For Materials Science
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Kimura Takashi
Materials Analysis Station National Institute For Materials Science
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Kimura Takashi
Material Analysis Station National Institute For Materials Science
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Hutter Matthias
Fraunhofer Institute for Reliability and Microintegration, IZM-Berlin, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany
関連論文
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