BGA Jointing Property of Sn-8.8mass%Zn and Sn-8.0mass%Zn-3.0mass%Bi Solder on Electroless Nickel-Phosphorus/Immersion Gold Plated Substrates

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概要

• 論文の詳細を見る
• 2003-09-01

著者

• Watanabe Tohru

  Department Of Applied Chemistry Graduate School Of Engineering Tokyo Metropolitan University

• Sugizaki Takashi

  Research & Development Department Meltex Incorporation

• Kimura Takashi

  Materials Analysis Station National Institute For Materials Science

• NAKAO Hidehiro

  Research & Development department, Meltex Incorporation

• Nakao Hidehiro

  Research & Development Department Meltex Incorporation

• Kimura Takashi

  Material Analysis Station National Institute For Materials Science

• WATANABE Tohru

  Department of Applied Chemistry, Graduate School of Engineering Tokyo Metropolitan University

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