Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates

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概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2004-12-20

著者

• Watanabe Tohru

  Department Of Applied Chemistry Graduate School Of Engineering Tokyo Metropolitan University

• Okamoto Naoki

  Department Of Applied Chemistry Graduate School Of Engineering Tokyo Metropolitan University

• Wang Feng

  Department Of Chemistry And Material Engineering Faculty Of Engineering Shinshu University

• Okamoto Naoki

  Department Of Applied Chemistry Graduate School Of Engineering Osaka University

• WANG Feng

  Department of Bioengineering and Robotics, Tohoku University

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