A Low Thermal-Budget High-Performanced 0.25-0.18um Merged Logic and DRAM
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概要
- 論文の詳細を見る
- 1999-09-20
著者
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Lin M.
United Microelectronics Corp. Specialty Technology Department Technology & Process Development D
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YEH W.
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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LIN Y.
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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CHEN T.
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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HUANG K.
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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CHEN Haber
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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CHOU L.
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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TSANG Samuel
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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HSU Kirk
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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LIN W.
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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JUNG L.
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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CHIEN S.
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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SUN S.
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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LIOU F.
United Microelectronics Corp., Specialty Technology Department, Technology & Process Development Div
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Hsu Kirk
United Microelectronics Corp. Specialty Technology Department Technology & Process Development D
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Chen Haber
United Microelectronics Corp. Specialty Technology Department Technology & Process Development D
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Tsang Samuel
United Microelectronics Corp. Specialty Technology Department Technology & Process Development D
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Lin W.
United Microelectronics Corp. Specialty Technology Department Technology & Process Development D
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Lin Y.
United Microelectronics Corp. Specialty Technology Department Technology & Process Development D
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Yeh W.
United Microelectronics Corp. Specialty Technology Department Technology & Process Development D
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Liou F.
United Microelectronics Corp. Specialty Technology Department Technology & Process Development D
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Liou F.
United Microelectronics Corp. Logic Technology Department Technology & Process Development Divis
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Chou L.
United Microelectronics Corp. Specialty Technology Department Technology & Process Development D
関連論文
- A Low Thermal-Budget High-Performanced 0.25-0.18um Merged Logic and DRAM
- High Performance Sub-0.1μm Dynamic Threshold MOSFET Using Indium Channel Implantation
- The Impact for Gate Oxide Scaling (32Å-12Å) and Power Supply for Sub-0.1μm CMOSFETs
- A Novel Shallow Trench Isolation with Mini-Spacer Technology
- Width Scaling and Layout Variation Effects on Dual Damascene Copper Interconnects Electromigration
- New Observations on the Narrow Width Effect of the Hot Carrier and NBTI Reliabilities in pMOSFETs with Various Types of Strains
- Optimization of Active Geometry Configuration and Shallow Trench Isolation (STI) Stress for Advanced CMOS Devices
- Copper Interconnect Electromigration Behavior in Various Structures and Precise Bimodal Fitting