電解水を用いたシリコンウエハーの超精密洗浄

概要

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This paper describes ultra-precision washing of the silicon wafer using dilute NaCl electrolyzed water. First, influence of dilute NaCl electrolyzed water on the surface of silicon wafer was clarified by immersing experiment that immerse the silicon wafer samples into electrolyzed water. Next, washing experiment was conducted about the silicon wafer after polish process using electrolyzed water and the present chemical solution, and the particle removal capability, ion residual substance removal capability of electrolyzed water were evaluated. Instead of the chemical solution, the result which can apply electrolyzed water to surface washing of the silicon wafer was obtained. As results to the study, following could be identified. (1) To the surface of the silicon wafer, electrolyzed reduced water has detailed etching action, and electrolyzed oxidized water does not have etching action. (2) Electrolyzed reduced water has the same particle removal capability as the chemical solution, and electrolyzed oxidized water has weak particle removal capability. (3) It has the ion residual substance removal capability of electrolyzed oxidized water and electrolyzed reduced water for both to have been superior to the present chemical solution.
公益社団法人精密工学会の論文
2005-06-05