Electrochemical and Simulative Studies of Trench Filling Mechanisms in the Copper Damascene Electroplating Process

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Mechanical and Dielectric Properties of a New Polymer Blend Composed of 1, 2-Bis (vinylphenyl) ethane and Thermosetting Poly (phenylene ether) Copolymer Obtained from 2, 6-Dimethylphenol and 2-Allyl-6-methylphenol
Low Dielectric Loss Copolymer Obtained from 2,6-Dimethylphenol and 2-Allyl-6-methylphenol via Cu-catalyzed Oxidative Coupling Polymerization
Cross Sections of Charge Transfer between Uranium Atoms and Ions Produced by Autoionization
Reduction of Charge Transfer Loss in Atomic Laser Isotope Separation by Production of Excited Ions through Autoionization Levels
Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction
Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects
Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating
Electrochemical and Simulative Studies of Trench Filling Mechanisms in the Copper Damascene Electroplating Process
Fast Diffusion of Water Molecules into Chemically Modified SiO_2 Films Formed by Chemical Vapor Deposition
Aspect Ratio Dependence of the Resistivity of Fine Line Cu Interconnects
Filling 80-nm-Wide and High-Aspect-Ratio Trench with Pulse Wave Copper Electroplating and Observation of the Microstructure
Comparison Studies on Mechanical and Electrical Properties of Epoxy / Silica Nanocomposites using Hydrophilic and Hydrophobic Silica
Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects
Comparison Studies on Mechanical and Electrical Properties of Epoxy/Silica Nanocomposites using Hydrophilic and Hydrophobic Silica

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