新型円筒マグネトロンスパッタ装置による被膜の構造

概要

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Metal films such as of Ti, Al and SUH310S were prepared in a new magnetron sputtering apparatus, and their structures were investigated through cross-sectional observations by scanning electron microscopy. The apparatus used consists of a cylindrical metal target which is electrically grounded, and two anode rings which are attached to both the top and bottom of the target. A wire as a substrate is placed along the center line of the cylindrical target. When the electrical potential of the substrate was varied, the formation rate depended on both the discharge voltage and the electrical potential of the substrate. When the substrate was electrically isolated, deposited films showed a slightly coarse columnar structure with thin voids between adjacent columns. On the contrary, in the case of the grounded substrate, deposited film did not show any clear columns but showed densely packed granular structure. No peeling region was observed between the film and substrate, indicating good adhesion.
日本真空協会の論文
1993-12-20