The Microassembly Technique for a 3D Single Crystaalline Silicon Structure Using a Polyimide/Chromium Cantilever

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概要

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• The microassembly technique on the wafer is key technology to realize multi-axis sensors (e. g. magnetometer) or three-dimensional micro systems (e. g. an optical system). We have investigated the bending of a polyimide/chromium cantilever to lift a silicon island (400×300×10μm3 and 1000×1000×240μm3) on the wafer at an angle of 90°, the planarization of a diced silicon sidewall and the bonding of a silicon island to the planarized silicon sidewall with polyimide interlayer. With this microassembly technique, the three-dimensional single crystalline silicon structures have been fabricated.

• 社団法人 電気学会の論文

著者

• Shibata Kenya

  Yamagata Kyowa Electronic Instruments Co. Ltd.

• WATANABE Yoshiyuki

  Yamagata Research Institute of Technology

• MINETA Takashi

  Yamagata Research Institute of Technology

• KOBAYASHI Seiya

  Yamagata Research Institute of Technology

• Kobayashi S

  Murata Manufacturing Co. Ltd.

関連論文

• The Microassembly Technique for a 3D Single Crystaalline Silicon Structure Using a Polyimide/Chromium Cantilever
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