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Tsukuba Research Center Electronic System Integration Technology Research Department Association Of | 論文
- Current Status of Research and Development for Three-Dimensional Chip Stack Technology
- Au Bump Interconnection in 20 μm Pitch on 3D Chip Stacking Technology
- Cu Bump Interconnections in 20 μm-Pitch at Low Temperature Utilizing Electroless Tin-Plating on 3D Stacked LSI
- Micro Bump Interconnection Technologies in 20μm Pitch on 3D System in Package
- Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20μm Pitch
- Fabrication of High-Density Wiring Interposer for 10GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide
- Micro Cu Bump Interconnection on 3D Chip Stacking Technology
- Au Bump Interconnection in 20 μm Pitch on 3D Chip Stacking Technology
- Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 μm Pitch
- Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide
- Current Status of Research and Development for Three-Dimensional Chip Stack Technology